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| PlerowTM ALN0859 Low Noise Amplifier Features 37.5 dB Gain at 859 MHz 18 dBm P1dB 37 dBm Output IP3 0.65 dB Noise Figure Operating at Single 5 V Supply 110 mA Current Consumption Description The plerow ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wirelss (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept less than unity over the application band in order to confirm its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. TM 2-stage Single Type Specifications Parameter Frequency Range Gain Gain Flatness Noise Figure Output IP3 S11 / S22 Output P1dB Supply Current Supply Voltage Impedance Max. RF Input Power @ CDMA 20FA Package Type & Size Unit MHz dB dB dB dBm dB dBm mA V dBm mm Specification 824 ~ 894 37.5 0.5 0.65 37 -14 / -14 18 110 5 50 5 SMT, 13Wx13Lx3.8H More Information Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea 1) Measurement conditions are as follows: T = 25C, VCC = 5 V, Freq. = 859 MHz, 50 ohm system. 2) OIP3 is measured with two tones at an output power of +8 dBm / tone separated by 1 MHz. 3) Note: We recommend that the VSWR toward a source and load be less than 1:4 to avoid an unwanted oscillation. Outline Drawing plerow ALN ASB Inc. TOP BOTTOM Pin Number 3 8 10 Others Function RF In RF Out +Vcc Ground SIDE : Soldering area Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. :o 0.4 plated thru holes to ground plane (Unit: mm) 1/1 SUGGESTED FOOTPRINT www.asb.co.kr August 2005 |
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